LMZ22010TZE/NOPB datasheet by Texas Instruments

LMZ22010TZE/NOPB Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance?
  A good PCB layout for the LMZ22010TZE/NOPB involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
• How do I ensure stability and prevent oscillations in the output voltage?
  To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, make sure to use a sufficient output capacitor with a low ESR, and consider adding a small ceramic capacitor in parallel with the output capacitor to improve stability.
• What is the maximum input voltage that can be applied to the device?
  The maximum input voltage that can be applied to the LMZ22010TZE/NOPB is 42V. Exceeding this voltage can cause damage to the device.
• How do I calculate the output voltage ripple and noise?
  The output voltage ripple and noise can be calculated using the equations provided in the datasheet. The output voltage ripple is primarily dependent on the output capacitor value, ESR, and the switching frequency. The noise is dependent on the switching frequency, output capacitor value, and the input voltage.
• What is the thermal derating curve for the device?
  The thermal derating curve for the LMZ22010TZE/NOPB is provided in the datasheet. The device can operate up to a junction temperature of 150°C, but the output current should be derated accordingly to prevent overheating.