A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 4-layer PCB with a solid ground plane and a thermal relief pattern can also help to dissipate heat efficiently.
To ensure reliable start-up and shutdown, it is recommended to use a soft-start circuit to limit the inrush current during start-up, and to use a voltage supervisor to monitor the input voltage and ensure that the device is fully powered up before enabling the output.
Key considerations for EMI filtering and noise reduction include using a pi-filter or a common-mode choke to reduce electromagnetic interference, and using a shielded inductor to reduce radiated emissions. Additionally, using a low-ESR output capacitor and a high-frequency bypass capacitor can help to reduce noise and ripple.
To optimize the device for high efficiency and low power loss, it is recommended to use a high-efficiency inductor, to minimize the DC resistance of the inductor and the output capacitor, and to optimize the switching frequency and dead time to minimize switching losses.
For high-temperature operation, it is recommended to derate the device's power rating according to the temperature derating curve provided in the datasheet. Additionally, it is recommended to use a heat sink and to ensure good airflow to keep the device temperature within the recommended operating range.
LMZ10505EXTTZE/NOPB datasheet
by Texas Instruments
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