LMH6703MF/NOPB datasheet by Texas Instruments

LMH6703MF/NOPB Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of the LMH6703MF?
  A good PCB layout for the LMH6703MF involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
• How do I choose the right output filter components for the LMH6703MF?
  The output filter components (Rf, Cf, and Lf) should be chosen based on the desired frequency response, output impedance, and power handling. A good starting point is to use the values recommended in the datasheet, and then adjust them based on the specific application requirements.
• What is the maximum power dissipation of the LMH6703MF, and how do I ensure it doesn't overheat?
  The maximum power dissipation of the LMH6703MF is 1.4W. To ensure it doesn't overheat, make sure to provide adequate heat sinking, use a thermally conductive PCB material, and keep the device away from other heat sources. The junction temperature should be kept below 150°C.
• Can I use the LMH6703MF in a differential output configuration?
  Yes, the LMH6703MF can be used in a differential output configuration. This can be achieved by using a transformer or a differential amplifier at the output stage. However, this requires careful design and layout to ensure common-mode rejection and minimize electromagnetic interference.
• How do I ensure electromagnetic compatibility (EMC) with the LMH6703MF?
  To ensure EMC with the LMH6703MF, use a shielded enclosure, keep the device away from other noise sources, use a common-mode choke at the input, and ensure good PCB layout practices. Additionally, use EMI filters and shielding on the input and output lines as needed.