Texas Instruments recommends a 4-layer PCB with a solid ground plane, and placing the device close to the analog signal sources to minimize noise. Additionally, it's recommended to keep the analog and digital grounds separate and connect them at a single point.
To optimize performance in a noisy environment, use a low-pass filter on the input signals, keep the device away from high-frequency sources, and use a shielded enclosure. Additionally, consider using a ferrite bead or a common-mode choke on the power supply lines to reduce noise.
The LMC6772AIM can drive a maximum capacitive load of 100pF. Exceeding this limit may cause instability or oscillation in the device.
Ensure good thermal conductivity between the device and the PCB, and provide adequate airflow around the device. Additionally, consider using a heat sink or a thermal pad to dissipate heat, especially in high-power applications.
The recommended power-up sequence is to apply the analog power supply (VCC) first, followed by the digital power supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry.
LMC6772AIM datasheet
by Texas Instruments
