A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a 2-3 layer board with a solid ground plane, and minimizing the distance between the device and the thermal pad or heat sink.
To ensure the device operates within the recommended operating conditions, monitor the input voltage, output voltage, and output current to ensure they are within the specified ranges. Also, ensure the device is operated within the recommended temperature range.
Exceeding the maximum junction temperature can lead to reduced device reliability, increased thermal resistance, and potentially even device failure. It is essential to ensure the device operates within the recommended temperature range to prevent these consequences.
The power dissipation of the device can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
The recommended input and output capacitors for the LM96163CISD/NOPB are 10uF and 22uF, respectively, with an ESR of less than 1 ohm. However, the optimal capacitor values may vary depending on the specific application and operating conditions.
LM96163CISD/NOPB datasheet
by Texas Instruments
