A good PCB layout for the LM96080CIMT/NOPB should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer PCB with a dedicated thermal layer is recommended.
To ensure the device operates within the recommended operating conditions, monitor the input voltage, output voltage, and output current. Implement overvoltage protection, undervoltage protection, and overcurrent protection to prevent damage to the device.
To minimize EMI and noise, use a pi-filter (L-C-L) or a common-mode choke at the input, and a ferrite bead or a small inductor at the output. Additionally, use a shielded inductor and a low-ESR output capacitor to reduce radiated emissions.
To optimize the device for low standby power consumption, ensure the enable pin is properly controlled, and the device is fully disabled during shutdown. Also, use a low-quiescent-current regulator for the bias supply, and consider using a low-power mode or a power gating technique.
To manage thermal performance, ensure good airflow around the device, and use a heat sink or a thermal interface material (TIM) to reduce the thermal resistance. Monitor the junction temperature and adjust the device's operating conditions to prevent overheating.
LM96080CIMT/NOPB datasheet
by Texas Instruments
