A 4-layer PCB with a solid ground plane and thermal vias is recommended. The thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.
Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range of -40°C to 125°C. Also, ensure the input voltage (VIN) is within the recommended range of 2.7V to 5.5V.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor (CIN). This ensures low ESR and high ripple current capability.
Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke to reduce EMI. Also, ensure the PCB layout is optimized for minimal loop area and radiation.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the output capacitor (COUT). This ensures low ESR and high ripple current capability.