A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a low-thermal-resistance path from the device to the heat sink or PCB ground plane.
Use a soft-start circuit to limit inrush current and ensure a controlled voltage ramp-up. For shutdown, use a power-good signal to monitor the output voltage and ensure a clean shutdown sequence.
Choose capacitors with low ESR, high ripple current rating, and a voltage rating that exceeds the maximum output voltage. Ensure the capacitors are placed close to the device to minimize parasitic inductance.
Use a type-III compensation network with a zero at the output filter pole frequency. Adjust the feedback resistors and capacitors to achieve a stable and fast transient response.
Ensure good airflow around the device, use a heat sink with a thermal interface material, and consider thermal vias or a thermal pad on the PCB to reduce thermal resistance.