A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
The input filter, output filter, and PCB layout are critical components that affect EMI performance. Ensure proper component selection and layout to minimize EMI emissions.
Use a low-dropout linear regulator or a low-power switching regulator to minimize power consumption. Optimize the device's operating frequency and voltage settings for low-power operation.
Ensure good thermal contact between the device and heat sink, use thermal interface materials, and design for adequate airflow to dissipate heat efficiently.
LM5000-3MTC/NOPB datasheet
by Texas Instruments
