LM3290TMX/NOPB datasheet by Texas Instruments

LM3290TMX/NOPB Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Texas Instruments recommends a thermal pad on the bottom of the package, connected to a copper plane on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper plane.
• How do I ensure reliable startup of the LM3290 in my design?
  To ensure reliable startup, Texas Instruments recommends a minimum input voltage of 2.5V, a minimum input capacitance of 1uF, and a maximum input resistance of 1kΩ. Additionally, the input voltage should rise monotonically to avoid false triggering.
• What is the maximum allowed voltage on the EN pin?
  The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may cause damage to the device.
• Can I use the LM3290 in a high-temperature environment?
  The LM3290 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Texas Instruments recommends derating the output current and voltage at high temperatures to ensure reliable operation.
• How do I calculate the output voltage ripple of the LM3290?
  The output voltage ripple of the LM3290 can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where Iout is the output current, ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.