A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some guidelines, but a more detailed application note from TI provides additional recommendations.
To ensure reliable start-up, it's essential to follow proper power sequencing and decoupling guidelines. TI recommends using a soft-start circuit to limit the inrush current and prevent voltage drops during start-up. Additionally, using a high-quality decoupling capacitor and following proper PCB layout practices can help mitigate noise issues.
Operating the LM2734XQMKE/NOPB at high ambient temperatures can affect its performance and reliability. TI recommends derating the device's output current and voltage ratings at higher temperatures to prevent overheating and ensure reliable operation. The datasheet provides thermal derating curves to help with this calculation.
To troubleshoot issues with output voltage regulation, start by verifying the input voltage, output voltage, and feedback voltage. Check for proper connections, decoupling, and component values. Use an oscilloscope to measure the output voltage ripple and noise. If issues persist, consult TI's application notes and technical support resources for further guidance.
The LM2734XQMKE/NOPB is designed to meet CISPR 22 and FCC Part 15 Class B EMI standards. To ensure EMI compliance, follow proper PCB layout practices, use a shielded inductor, and add EMI filters as needed. TI provides additional guidance on EMI mitigation in their application notes and technical support resources.
LM2734XQMKE/NOPB datasheet
by Texas Instruments
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