Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. A thermal pad on the bottom of the package should be connected to the ground plane.
To ensure reliable operation in high-temperature environments, it is recommended to derate the output current and voltage according to the thermal derating curve provided in the datasheet. Additionally, ensure good airflow and thermal conduction to the heat sink.
A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input capacitor. This helps to filter out high-frequency noise and ensure stable operation.
To prevent oscillations and instability, ensure that the output capacitor is properly sized and has a low ESR. Additionally, add a small ceramic capacitor (e.g. 10nF) in parallel with the output capacitor to filter out high-frequency noise.
A low-ESR ceramic or polymer capacitor with a value of 22uF to 47uF is recommended for the output capacitor. This helps to filter out high-frequency noise and ensure stable operation.