A good PCB layout for the LM1875T/LB02 involves keeping the input and output stages separate, using a star-ground configuration, and placing the decoupling capacitors close to the IC. Additionally, using a 4-layer PCB with a dedicated ground plane can help reduce noise and EMI.
The choice of gain resistors depends on the desired gain and input impedance. A higher gain setting can provide more amplification, but may also increase noise and distortion. A lower gain setting can provide a cleaner signal, but may not provide enough amplification. TI provides a gain calculator tool to help with resistor selection.
The LM1875T/LB02 has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good airflow, use a heat sink if necessary, and avoid overheating the device. TI provides thermal design guidelines and a thermal calculator tool to help with thermal management.
To filter out noise and hum, use a combination of passive and active filtering techniques. Use capacitors to filter out high-frequency noise, and consider adding a notch filter to remove specific frequency hum. Additionally, use shielding and grounding techniques to minimize electromagnetic interference.
The LM1875T/LB02 has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent damage. Use anti-static wrist straps, mats, and bags, and avoid touching the device's pins or exposed internal circuitry.