A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
Implement a heat sink or thermal pad, and ensure good airflow. Monitor the junction temperature (Tj) and adjust the thermal design accordingly. The maximum Tj is 150°C.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input filter. The capacitor should be placed close to the IC and have a low ESR (Equivalent Series Resistance).
Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the input lines. Ensure good grounding and decoupling, and consider adding EMI filters.
The maximum output current is 4A, but it's recommended to derate the output current to 3.5A for reliable operation and to prevent overheating.