A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
Use a heat sink with a thermal resistance of 10°C/W or lower, and ensure good airflow around the device. Also, derate the output current according to the temperature derating curve in the datasheet.
The SOA is limited by the maximum junction temperature (Tj) of 150°C. Ensure that the device operates within the recommended voltage and current ranges to prevent overheating.
Use a TVS (transient voltage suppressor) diode or a zener diode to clamp voltage transients. Add a fuse or a PTC (positive temperature coefficient) thermistor to protect against overcurrent conditions.
Use a low-ESR (equivalent series resistance) ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage range. X5R or X7R dielectrics are recommended for their stability across temperature and voltage ranges.
