A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Implement a heat sink or thermal interface material to reduce junction-to-case thermal resistance. Ensure good airflow and avoid blocking airflow around the device.
The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause permanent damage to the device.
Use ESD protection devices such as TVS diodes or ESD arrays on the input lines, and ensure a low-impedance path to ground for ESD discharge.
A 10nF to 100nF input capacitance is recommended to filter out high-frequency noise and ensure stable operation.
