STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure optimal thermal performance.
To ensure reliable operation at high temperatures, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet, and to ensure good thermal conduction between the device and the heat sink.
STMicroelectronics recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 30-45 seconds, and a cooling rate of 4°C/s to minimize thermal stress on the device.
To protect the device from ESD, it is recommended to handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and tools are properly grounded.
STMicroelectronics recommends storing the device in a dry, cool place, away from direct sunlight, with a relative humidity below 60% and a temperature range of -40°C to 125°C.
LDK130M18RY datasheet
by STMicroelectronics
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