STMicroelectronics recommends a 4-layer PCB with a solid ground plane and a separate power plane for the LDK130M18R. The device should be placed near the power supply and the output capacitors should be placed close to the device.
The LDK130M18R has a thermal pad that must be connected to a thermal plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink. Ensure good airflow around the device and consider using a heat sink with a thermal conductivity of at least 1 W/m-K.
STMicroelectronics recommends using a low-ESR ceramic capacitor with a value of 10-22 μF and a voltage rating of at least 25 V. The capacitor should be placed close to the VIN pin and the GND pin.
The output capacitor should be selected based on the output voltage and current requirements. A low-ESR ceramic capacitor with a value of 10-47 μF and a voltage rating of at least 2x the output voltage is recommended. The capacitor should be placed close to the VOUT pin and the GND pin.
The recommended input voltage range for the LDK130M18R is 4.5-18 V. Operating the device outside of this range may affect its performance and reliability.
LDK130M18R datasheet
by STMicroelectronics
