A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the copper area should be connected to a ground plane to reduce thermal resistance.
The device is rated for operation up to 125°C. To ensure reliable operation, it's essential to follow proper thermal design and layout guidelines, and to consider derating the device's power handling capabilities at higher temperatures.
A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the device's input pins as possible to minimize noise and ripple.
To troubleshoot OCP issues, check the input voltage, output current, and sense resistor values. Ensure that the sense resistor is properly connected and that the output current is within the specified range. Also, verify that the OCP threshold is set correctly.
A low-ESR ceramic capacitor with a value of 10uF to 47uF is recommended for output filtering. The capacitor should be placed as close to the device's output pins as possible to minimize noise and ripple.
Findchips
Findchips