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    Part Img L99H01XP datasheet by STMicroelectronics

    • PMIC - Motor, Bridge Drivers, Integrated Circuits (ICs), IC MOTOR CONTROLLER SPI 36PWRSSO
    • Original
    • Yes
    • Unknown
    • Not Recommended
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com

    L99H01XP datasheet preview

    L99H01XP Frequently Asked Questions (FAQs)

    • STMicroelectronics provides a recommended PCB layout in the application note AN4846, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
    • The L99H01XP is a highly configurable device that supports various vehicle protocols such as SAE J1850, ISO 9141-2, and ISO 15765-4. Configuration is done through the SPI interface, and STMicroelectronics provides a software development kit (SDK) and documentation to help with protocol configuration and customization.
    • The maximum cable length supported by the L99H01XP depends on the specific vehicle protocol and the cable characteristics. As a general guideline, STMicroelectronics recommends keeping the cable length below 10 meters for SAE J1850 and ISO 9141-2 protocols, and below 40 meters for ISO 15765-4 protocol. However, it's essential to perform signal integrity analysis and testing to ensure reliable communication over the desired cable length.
    • The L99H01XP has built-in bus fault detection capabilities, including voltage, current, and protocol-specific fault detection. In case of a fault, the device can be configured to enter a fault mode, and the host microcontroller can be notified through the SPI interface. Recovery from a fault mode typically involves resetting the device and re-initializing the communication protocol. STMicroelectronics provides guidelines and example code for fault handling and recovery in the device's documentation and SDK.
    • The L99H01XP is a high-power device that requires proper thermal management to ensure reliable operation. STMicroelectronics recommends using a heat sink or thermal pad to dissipate heat, and provides thermal resistance and power dissipation data in the datasheet. Additionally, the device has a built-in thermal shutdown feature that can be configured to prevent overheating and damage.
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