A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Use a soft-start circuit to limit the inrush current during startup. For shutdown, ensure a controlled shutdown sequence to prevent voltage spikes and ensure all internal circuits are properly discharged.
Use a common-mode choke, X-capacitors, and Y-capacitors to filter out electromagnetic interference. Ensure the filter components are placed close to the L6738ATR and connected to a solid ground plane.
Use the low-power mode (LP) pin to reduce standby power consumption. Ensure the input voltage is within the recommended range, and use a low-dropout linear regulator (LDO) for the internal voltage regulator.
Use a heat sink with a thermal resistance of ≤ 10°C/W. Ensure good thermal contact between the device and heat sink using a thermal interface material. Keep the heat sink away from other components to prevent thermal coupling.
