A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation.
Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure proper PCB design and component selection to minimize thermal resistance.
Monitor the output voltage, current, and temperature. Implement over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP) to prevent damage and ensure safe operation.
Use a combination of capacitors and inductors to filter the output. Optimize the filter design using simulation tools and consider the output voltage, current, and frequency to achieve minimal ripple and noise.
Use low-ESR capacitors with a minimum capacitance of 10uF for the input and output. Ensure the capacitors are rated for the maximum operating voltage and temperature range.