JCK1512D15 datasheet by XP Power

JCK1512D15 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  XP Power recommends a PCB layout with a large copper area for heat dissipation, and a thermal management system with a heat sink and thermal interface material to keep the junction temperature below 125°C.
• How do I ensure electromagnetic compatibility (EMC) with this module?
  To ensure EMC, XP Power recommends following the layout and grounding guidelines in the datasheet, using a metal enclosure, and adding EMI filters and shielding as necessary.
• What is the derating curve for this module at high temperatures?
  The derating curve for the JCK1512D15 is typically provided in the datasheet or can be obtained from XP Power's application notes. It shows the maximum output power vs. temperature, and is typically around 50% at 80°C and 20% at 100°C.
• Can I use this module in a high-vibration environment?
  The JCK1512D15 is designed to meet the vibration requirements of IEC 60068-2-6, but XP Power recommends consulting their application notes and performing additional testing to ensure reliability in high-vibration environments.
• What is the MTBF (Mean Time Between Failures) of this module?
  The MTBF of the JCK1512D15 is typically around 1.5 million hours, calculated according to MIL-HDBK-217F, but this may vary depending on the specific application and operating conditions.