JCB0305S15 datasheet by XP Power

JCB0305S15 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
• Can I use this module in a high-vibration environment?
  Yes, the JCB0305S15 is designed to withstand high-vibration environments. It meets the IEC 60068-2-6 vibration test standard, which simulates vibrations up to 10G peak acceleration. However, it's recommended to consult with XP Power's application engineers to ensure the module is properly secured and mounted.
• How do I ensure the module's input voltage is within the specified range?
  To ensure the input voltage is within the specified range, XP Power recommends using a voltage regulator or a DC-DC converter with a tight output voltage tolerance. Additionally, the input voltage should be monitored and controlled using voltage monitoring ICs or supervisory circuits.
• What is the maximum capacitance I can use on the output?
  The maximum capacitance on the output depends on the specific application and the desired output voltage ripple. As a general guideline, XP Power recommends limiting the output capacitance to 10uF or less to ensure stable operation. However, it's recommended to consult with XP Power's application engineers for specific guidance.
• Can I use this module in a redundant or parallel configuration?
  Yes, the JCB0305S15 can be used in a redundant or parallel configuration to achieve higher power or redundancy. However, it's essential to consult with XP Power's application engineers to ensure proper design and implementation of the redundant or parallel configuration.