XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
Yes, the ITP0324S05 is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's recommended to follow XP Power's guidelines for mounting and securing the module to ensure reliable operation.
To ensure EMC, XP Power recommends following proper PCB layout and design practices, such as keeping sensitive analog circuits away from the DC-DC converter, using shielded cables, and implementing adequate filtering and shielding. Additionally, the module meets EN 55022 and EN 55024 EMC standards.
The maximum allowable capacitance on the output of the ITP0324S05 is 2200uF. Exceeding this value may affect the module's stability and performance. It's recommended to consult XP Power's application notes for guidance on output capacitance selection.
Yes, the ITP0324S05 can be used in redundant or parallel configurations to achieve higher power or redundancy. However, it's essential to follow XP Power's guidelines for synchronization and current sharing to ensure reliable operation and avoid potential issues.
