A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 150°C. Ensure proper PCB design, component selection, and thermal interface material usage.
Use X7R or X5R ceramic capacitors with a voltage rating of 25V or higher. For input capacitors, use 10uF to 22uF, and for output capacitors, use 22uF to 47uF.
Use a shielded enclosure, keep the ITA25B1 away from antennas and high-frequency components, and ensure proper PCB layout and grounding. Implement EMI filters or common-mode chokes if necessary.
Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.