The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 2.5mm x 2.5mm, and ensuring that the thermal pad is connected to a large copper area on the PCB to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power handling capability according to the temperature derating curve provided in the datasheet, and to ensure good thermal management through proper PCB design and heat sinking.
The recommended gate drive voltage for optimal performance is between 10V and 15V, with a minimum rise and fall time of 10ns to ensure fast switching and minimize power losses.
To protect the device from overvoltage and overcurrent conditions, it is recommended to use a suitable overvoltage protection circuit, such as a zener diode or a transient voltage suppressor, and to implement overcurrent protection using a current sense resistor and a comparator or a dedicated overcurrent protection IC.
The recommended dead time for the high-side and low-side switches is typically between 100ns and 500ns, depending on the specific application requirements and the switching frequency.
IRS2336DMTRPBF datasheet
by International Rectifier
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