The maximum allowed case temperature for the IRGP50B60PD1-EP is 125°C, as specified in the datasheet.
Proper thermal management for the IRGP50B60PD1-EP involves ensuring good heat sinking, using a thermal interface material, and keeping the module away from heat sources. A heat sink with a thermal resistance of 0.5°C/W or lower is recommended.
The recommended gate resistance for the IRGP50B60PD1-EP is between 10 ohms and 20 ohms to ensure proper switching and minimize oscillations.
Yes, the IRGP50B60PD1-EP can be used in a parallel configuration, but it's essential to ensure that the modules are matched and that the gate drives are synchronized to prevent uneven current sharing.
The maximum allowed voltage transient for the IRGP50B60PD1-EP is 120% of the maximum rated voltage, which is 600V. This means the module can withstand voltage transients up to 720V.