The maximum allowed case temperature for the IRG4BC30W is 125°C, as specified in the datasheet. However, it's recommended to keep the case temperature below 100°C for reliable operation and to prevent thermal runaway.
The thermal resistance of the IRG4BC30W can be calculated using the thermal impedance Zth(j-c) and Zth(c-s) values provided in the datasheet. The total thermal resistance is the sum of the junction-to-case thermal resistance (Rth(j-c)) and the case-to-sink thermal resistance (Rth(c-s)).
The recommended gate resistance for the IRG4BC30W is between 10 ohms and 100 ohms. A higher gate resistance can help reduce electromagnetic interference (EMI) and improve noise immunity, but may also increase the turn-on time and reduce the switching frequency.
Yes, the IRG4BC30W can be used in a parallel configuration to increase the current handling capability. However, it's essential to ensure that the modules are matched in terms of their electrical characteristics and thermal performance to prevent uneven current sharing and thermal runaway.
The maximum allowed voltage transient for the IRG4BC30W is ±10% of the rated voltage, as specified in the datasheet. Exceeding this limit can cause damage to the device or affect its reliability.
IRG4BC30W datasheet
by International Rectifier
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