The maximum junction temperature of the IRFB3207PBF is 175°C, but it's recommended to operate at a maximum of 150°C for reliable operation and to prevent thermal runaway.
The thermal resistance of the IRFB3207PBF can be calculated using the junction-to-case thermal resistance (RθJC) and the case-to-ambient thermal resistance (RθCA). The RθJC is specified in the datasheet as 0.5°C/W, and the RθCA depends on the heat sink and cooling system used. You can use the following formula: RθJA = RθJC + RθCA.
The recommended gate drive voltage for the IRFB3207PBF is between 10V and 15V. A higher gate drive voltage can reduce the switching losses, but it may also increase the gate oxide stress and reduce the reliability of the device.
Yes, the IRFB3207PBF is suitable for high-frequency switching applications up to 100 kHz. However, you need to ensure that the gate drive circuitry and the layout are optimized for high-frequency operation to minimize the switching losses and electromagnetic interference (EMI).
You can protect the IRFB3207PBF from overvoltage and overcurrent by using a voltage clamp circuit and a current sense resistor. The voltage clamp circuit can be implemented using a zener diode or a transient voltage suppressor (TVS) diode, and the current sense resistor can be used to monitor the current and trigger an overcurrent protection circuit.