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    IRF9630 datasheet by International Rectifier

    • TO-220 Plastic Package HEXFETs
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    • EAR99
    • 8541.29.00.95
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    IRF9630 datasheet preview

    IRF9630 Frequently Asked Questions (FAQs)

    • The maximum safe operating area (SOA) for the IRF9630 is not explicitly stated in the datasheet, but it can be determined by consulting the International Rectifier application note AN-936, which provides guidelines for calculating the SOA for power MOSFETs.
    • To ensure proper thermal management, the IRF9630 should be mounted on a heat sink with a thermal resistance of less than 1°C/W. The heat sink should be designed to dissipate the maximum expected power dissipation, and the device should be attached to the heat sink using a thermal interface material with a thermal resistance of less than 0.1°C/W.
    • The recommended gate drive voltage for the IRF9630 is between 10V and 15V, with a maximum gate-source voltage of 20V. A higher gate drive voltage can improve switching performance, but may also increase power consumption and EMI.
    • To protect the IRF9630 from overvoltage and overcurrent, a voltage clamp or transient voltage suppressor (TVS) can be used to limit the voltage across the device. Additionally, a current sense resistor and a fuse or circuit breaker can be used to detect and interrupt overcurrent conditions.
    • The maximum allowed dv/dt for the IRF9630 is not explicitly stated in the datasheet, but it is typically recommended to limit dv/dt to less than 1000V/μs to prevent voltage-induced turn-on and ensure reliable operation.
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