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    Part Img IRF540NLPBF datasheet by International Rectifier

    • 100V Single N-Channel HEXFET Power MOSFET in a TO-262 package
    • Original
    • Yes
    • Yes
    • Transferred
    • EAR99
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    IRF540NLPBF datasheet preview

    IRF540NLPBF Frequently Asked Questions (FAQs)

    • The maximum safe operating area (SOA) for the IRF540NLPBF is not explicitly stated in the datasheet, but it can be estimated based on the device's voltage and current ratings. As a general rule, it's recommended to operate the device within 80% of its maximum voltage and current ratings to ensure safe operation.
    • The junction-to-case thermal resistance (RθJC) for the IRF540NLPBF is not explicitly stated in the datasheet, but it can be calculated using the thermal resistance values provided in the datasheet. RθJC can be estimated as RθJC = RθJA - RθCS, where RθJA is the junction-to-ambient thermal resistance and RθCS is the case-to-sink thermal resistance.
    • The recommended gate drive voltage for the IRF540NLPBF is typically between 10V to 15V, depending on the specific application and switching frequency. A higher gate drive voltage can improve the device's switching performance, but it also increases the power consumption and EMI emissions.
    • Yes, the IRF540NLPBF can be used in high-frequency switching applications, but it's essential to consider the device's switching characteristics, such as the rise and fall times, and the gate charge. The device's datasheet provides information on its high-frequency performance, and it's recommended to consult with the manufacturer's application notes for specific guidance.
    • To ensure proper cooling of the IRF540NLPBF, it's essential to provide a sufficient heat sink and thermal interface material (TIM) between the device and the heat sink. The heat sink should be designed to dissipate the maximum power dissipation of the device, and the TIM should have a low thermal resistance. Additionally, the device's thermal pad should be connected to a low-impedance thermal path to ensure efficient heat transfer.
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