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    IRF250R datasheet by Harris Semiconductor

    • Power MOSFET Data Book 1990
    • Scan
    • No
    • Unknown
    • Obsolete
    • EAR99
    • 8541.29.00.95
    • 8541.29.00.80
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    IRF250R datasheet preview

    IRF250R Frequently Asked Questions (FAQs)

    • The maximum safe operating area (SOA) for the IRF250R is not explicitly stated in the datasheet, but it can be estimated based on the device's voltage and current ratings. As a general rule, it's recommended to operate the device within the boundaries of the SOA curve provided in the datasheet to ensure reliable operation.
    • The junction-to-case thermal resistance (RθJC) for the IRF250R can be calculated using the formula: RθJC = (TJ - TC) / P, where TJ is the junction temperature, TC is the case temperature, and P is the power dissipation. The datasheet provides the thermal resistance values for the device, but the actual RθJC value may vary depending on the specific application and cooling conditions.
    • The recommended gate drive voltage for the IRF250R is typically between 10V to 15V, depending on the specific application and switching frequency. A higher gate drive voltage can improve the device's switching performance, but it may also increase the power consumption and EMI emissions.
    • To ensure the IRF250R is properly biased for linear operation, it's essential to provide a stable gate-source voltage (VGS) and a suitable drain-source voltage (VDS). The datasheet provides guidelines for the recommended biasing conditions, but the actual biasing requirements may vary depending on the specific application and operating conditions.
    • The common failure modes for the IRF250R include overvoltage, overcurrent, overheating, and electrostatic discharge (ESD). To minimize the risk of failure, it's essential to follow proper design and assembly practices, such as using adequate heat sinking, voltage clamping, and ESD protection.
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