The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with multiple vias to the bottom layer, and using a large copper area on the top and bottom layers to dissipate heat. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power handling capability, use a heat sink, and ensure good airflow around the device. Additionally, the device should be operated within its specified junction temperature range.
The recommended soldering conditions for the IR3710MTRPBF are a peak temperature of 260°C, a dwell time of 10-30 seconds, and a soldering iron temperature of 350°C. It is also recommended to use a solder with a melting point of 220°C or higher.
To protect the device from electrostatic discharge (ESD), it is recommended to handle the device with an anti-static wrist strap or mat, use ESD-safe packaging and storage, and ensure that the device is properly grounded during assembly and testing.
The recommended storage and handling conditions for the IR3710MTRPBF are a temperature range of -40°C to 125°C, a humidity range of 5% to 95%, and protection from direct sunlight and moisture. The device should be stored in its original packaging or an anti-static bag.
IR3710MTRPBF datasheet
by International Rectifier
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