The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with multiple vias to the bottom layer, and using a large copper area on the top and bottom layers to dissipate heat. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, the device should be derated according to the temperature derating curve provided in the datasheet.
To prevent damage, it is essential to handle the device by the body and not the leads, use an anti-static wrist strap or mat, and avoid touching the pins or leads with bare hands. The device should also be stored in an anti-static bag or tube when not in use.
Yes, the IR3651STRPBF is designed to meet the requirements of electromagnetic compatibility (EMC) and can be used in designs that require a high level of EMC. However, it is essential to follow proper PCB layout and design practices to minimize electromagnetic interference (EMI).
The recommended soldering profile for the IR3651STRPBF involves a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 3-5 minutes. It is essential to follow the recommended soldering profile to prevent damage to the device.
IR3651STRPBF datasheet
by International Rectifier
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