IR2301SPBF datasheet by International Rectifier

IR2301SPBF Frequently Asked Questions (FAQs)

• What is the maximum operating frequency of the IR2301SPBF?
  The maximum operating frequency of the IR2301SPBF is 1 MHz, but it can be used up to 2 MHz with some limitations. However, it's recommended to consult with the application notes and design guidelines for specific use cases.
• How do I ensure the bootstrap capacitor is properly sized for my application?
  The bootstrap capacitor should be sized based on the maximum voltage and current requirements of the high-side driver. A general rule of thumb is to use a capacitor with a value of at least 10nF to 22nF, and a voltage rating of at least 2x the maximum voltage of the high-side driver. Consult the application notes for more detailed guidance.
• What is the recommended layout and placement for the IR2301SPBF to minimize EMI and noise?
  To minimize EMI and noise, it's recommended to follow a compact layout with short traces, and to place the IR2301SPBF close to the power MOSFET. The bootstrap capacitor should be placed as close as possible to the IR2301SPBF, and the high-side driver output should be routed away from sensitive analog circuits. Consult the application notes for more detailed layout and placement guidelines.
• How do I handle the dead time between the high-side and low-side drivers to prevent shoot-through current?
  The IR2301SPBF has a built-in dead time generator that can be adjusted using external resistors. The recommended dead time is typically around 100-200 ns, but this may vary depending on the specific application and power MOSFET characteristics. Consult the application notes for more detailed guidance on dead time adjustment.
• What are the thermal considerations for the IR2301SPBF, and how do I ensure proper heat sinking?
  The IR2301SPBF has a maximum junction temperature of 150°C. To ensure proper heat sinking, it's recommended to use a thermal pad or heat sink with a thermal resistance of less than 10°C/W. The device should be mounted on a PCB with a solid copper plane to help dissipate heat. Consult the application notes for more detailed thermal design guidelines.