The recommended PCB layout for optimal thermal performance involves placing a thermal pad underneath the IC, using multiple vias to connect the thermal pad to an internal copper plane, and ensuring good airflow around the device.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable heat sink, and ensure that the device is operated within its specified temperature range.
The critical parameters to monitor during operation to prevent overheating include the device's junction temperature, output current, and input voltage. It's also essential to monitor the device's thermal resistance and ensure it's within the specified range.
The IR1167ASTRPBF is an automotive-grade device, and it's suitable for use in high-reliability and automotive applications. However, it's essential to follow the recommended design and layout guidelines, and to ensure that the device is operated within its specified parameters.
The recommended soldering and assembly techniques for this device include using a soldering iron with a temperature range of 250°C to 260°C, and following the recommended soldering profile. It's also essential to handle the device by the body, and to avoid touching the leads or pins.
IR1167ASTRPBF datasheet
by International Rectifier
