Siemens recommends a 4-layer PCB with a dedicated power plane, and thermal vias under the device to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended for the power plane.
Siemens recommends using a heat sink with a thermal resistance of ≤ 10 K/W, and ensuring a maximum junction temperature of 150°C. Additionally, derating the output current and voltage can help ensure reliable operation in high-temperature environments.
Siemens recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, and a voltage rating of 50-100 V, placed as close as possible to the input pins of the ILD250.
Siemens recommends using an oscilloscope to monitor the input and output waveforms, and checking for proper PCB layout, thermal management, and component selection. Additionally, checking the device's fault pins and using Siemens' provided evaluation boards and software can aid in debugging.
Siemens recommends keeping the output voltage ripple below 1% of the nominal output voltage to ensure reliable operation and minimize electromagnetic interference (EMI).
