The recommended land pattern for IHLP5050CEER2R2M06 is a rectangular pad with a size of 5.5 mm x 5.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While IHLP5050CEER2R2M06 has a rated operating temperature range of -40°C to +125°C, it's not recommended for high-temperature applications above 105°C due to potential degradation of the magnetic core and insulation. For high-temperature applications, consider using a high-temperature-rated inductor like IHLP5050CEER2R2M11.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the component to prevent overheating. Also, ensure the component is properly aligned with the pads and that the solder joints are clean and free of oxidation.
Yes, IHLP5050CEER2R2M06 is compatible with lead-free soldering processes. The component is RoHS-compliant and can be soldered using lead-free solder alloys like SAC305 or Sn96.5Ag3Cu0.5.
The ESR of IHLP5050CEER2R2M06 is not explicitly stated in the datasheet, but it can be estimated to be around 10-20 mΩ based on the component's design and materials. However, for accurate ESR values, it's recommended to consult with Vishay's application engineers or perform measurements using a suitable test setup.
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