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    IHLP5050CEER2R2M01 datasheet by Vishay Dale

    • Fixed Inductors, Inductors, Coils, Chokes, INDUCTOR POWER 2.2UH 16A SMD
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8504.50.80.00
    • 8504.50.00.00
    • Find it at Findchips.com

    IHLP5050CEER2R2M01 datasheet preview

    IHLP5050CEER2R2M01 Frequently Asked Questions (FAQs)

    • The recommended PCB footprint for the IHLP5050CEER2R2M01 is a rectangular pad with a length of 5.5 mm, a width of 5.5 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
    • The IHLP5050CEER2R2M01 has a maximum operating temperature of 125°C. To handle thermal derating, ensure that the inductor is operated within its specified temperature range, and consider using a heat sink or thermal interface material to reduce the temperature rise. You can also use thermal simulation tools to estimate the temperature rise and design accordingly.
    • The self-resonant frequency (SRF) of the IHLP5050CEER2R2M01 is not explicitly stated in the datasheet. However, based on the inductor's construction and materials, the SRF is typically in the range of 100-200 MHz. To determine the SRF, you can use impedance analyzers or network analyzers to measure the inductor's impedance versus frequency.
    • Yes, the IHLP5050CEER2R2M01 is suitable for high-reliability applications. Vishay Intertechnologies is a reputable manufacturer, and the inductor is built with high-quality materials and undergoes rigorous testing. However, it's essential to follow proper design, manufacturing, and testing procedures to ensure the inductor meets the required reliability standards.
    • To ensure magnetic shielding, keep the IHLP5050CEER2R2M01 at least 2-3 mm away from other magnetic components, such as transformers or other inductors. You can also use magnetic shielding materials, like mu-metal or ferrite, to reduce electromagnetic interference (EMI). Additionally, consider using a shielded inductor or a common-mode choke to minimize EMI.
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