The recommended land pattern for the IHLP2525CZER3R3M11 is a rectangular pad with a size of 2.5 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP2525CZER3R3M11 has a maximum operating temperature of 125°C. Ensure good airflow around the inductor, and consider using a thermal interface material (TIM) to improve heat transfer between the inductor and the PCB.
The SRF of the IHLP2525CZER3R3M11 is not explicitly stated in the datasheet, but it can be estimated using the inductor's inductance and capacitance values. A rough estimate is around 100-150 MHz.
Yes, the IHLP2525CZER3R3M11 is suitable for high-reliability applications. It is built with a robust construction and has undergone rigorous testing to ensure its performance and reliability.
Follow the recommended soldering profile for the IHLP2525CZER3R3M11, which is a peak temperature of 260°C for 10-15 seconds. Ensure the inductor is properly aligned with the PCB pads and that the solder joints are clean and free of oxidation.
