The recommended PCB footprint for the IHLP2525AHERR33M01 is a rectangular pad with a length of 2.5 mm, a width of 2.5 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
The IHLP2525AHERR33M01 has a temperature derating curve specified in the datasheet. To handle thermal derating, ensure that the inductor's operating temperature is within the specified range, and consider using a heat sink or thermal interface material to reduce the temperature rise.
The SRF of the IHLP2525AHERR33M01 is not explicitly stated in the datasheet, but it can be estimated using the inductor's inductance and capacitance values. A rough estimate of the SRF can be calculated using the formula: SRF ≈ 1 / (2 * π * sqrt(L * C)), where L is the inductance and C is the capacitance.
The IHLP2525AHERR33M01 is designed for high-frequency applications, but its performance may degrade above a certain frequency. Check the datasheet for the inductor's frequency response and ensure that it meets your application's requirements.
To ensure the reliability of the IHLP2525AHERR33M01 in a high-reliability application, follow proper storage and handling procedures, use a robust PCB design, and consider using a conformal coating to protect the inductor from environmental factors.
