The recommended land pattern for the IHLP1616BZER1R0M11 is a rectangular pad with a size of 1.6 mm x 1.6 mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP1616BZER1R0M11 has a maximum operating temperature of 125°C. Ensure good airflow around the inductor, and consider using a heat sink or thermal interface material if high currents or high ambient temperatures are expected.
The self-resonant frequency of the IHLP1616BZER1R0M11 is not explicitly stated in the datasheet, but it can be estimated to be around 100-200 MHz based on the inductor's physical characteristics and similar products.
The IHLP1616BZER1R0M11 is a surface-mount device and can be susceptible to vibration-induced failure. Ensure that the PCB is properly secured and consider using a vibration-dampening material or potting the inductor if high vibrations are expected.
Follow standard surface-mount soldering practices, ensuring the inductor is properly aligned and the soldering iron is set to the recommended temperature (around 260°C). Use a solder with a melting point above 217°C to ensure reliable joints.
