The recommended land pattern for the IHLP1616ABER2R2M11 is a rectangular pad with a size of 1.6 mm x 1.6 mm, with a non-solder mask defined (NSMD) pad shape.
To handle the IHLP1616ABER2R2M11's sensitivity to moisture, it is recommended to follow the MSL (Moisture Sensitivity Level) guidelines, which include baking the components before reflow soldering, and using a nitrogen-filled packaging to prevent moisture absorption.
The maximum operating temperature range for the IHLP1616ABER2R2M11 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
To ensure the IHLP1616ABER2R2M11 is properly soldered, it is recommended to use a reflow soldering process with a peak temperature of 260°C, and to follow the recommended soldering profile provided in the datasheet.
The equivalent series resistance (ESR) of the IHLP1616ABER2R2M11 is 0.025 ohms maximum at 100 kHz, and 0.035 ohms maximum at 1 MHz.
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