The recommended land pattern for the IHLP1212BZER3R3M11 is a rectangular pad with a size of 3.3 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP1212BZER3R3M11 is a moisture-sensitive device. It is recommended to store the components in a dry environment, and to follow the recommended baking and drying procedures before reflow soldering.
The maximum operating temperature range for the IHLP1212BZER3R3M11 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
The self-resonant frequency of the IHLP1212BZER3R3M11 can be calculated using the formula: f_res = 1 / (2 * π * sqrt(L * C)), where L is the inductance and C is the parasitic capacitance.
The recommended reflow soldering profile for the IHLP1212BZER3R3M11 is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C.
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