The recommended land pattern for the IHLP1212BZER1R2M11 is a rectangular pad with a size of 3.3 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP1212BZER1R2M11 is a moisture-sensitive device. It is recommended to store the components in a dry environment, and to follow the recommended baking and drying procedures before reflow soldering.
The maximum operating temperature range for the IHLP1212BZER1R2M11 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
To minimize magnetic field interference, it is recommended to keep the IHLP1212BZER1R2M11 at least 5 mm away from nearby components, and to use shielding or magnetic shielding materials if necessary.
The recommended soldering profile for the IHLP1212BZER1R2M11 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
