IE0315S datasheet by XP Power

IE0315S Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure efficient heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
• Can I use the IE0315S in a high-vibration environment?
  Yes, the IE0315S is designed to withstand high-vibration environments. However, it's essential to ensure that the module is properly secured to the PCB and that the PCB is rigid enough to prevent flexing or resonance that could affect the module's performance.
• What is the maximum capacitance I can use on the output?
  The maximum capacitance on the output of the IE0315S is 2200uF. Exceeding this value may affect the module's stability and performance. It's recommended to consult with XP Power's application engineers for specific guidance on output capacitance selection.
• Can I use the IE0315S in a redundant configuration?
  Yes, the IE0315S can be used in a redundant configuration to achieve high reliability and fault tolerance. However, it's crucial to ensure that the modules are properly synchronized and that the system is designed to handle the increased power consumption and heat generation.
• What is the typical MTBF (Mean Time Between Failures) of the IE0315S?
  The typical MTBF of the IE0315S is >1.5 million hours, calculated according to MIL-HDBK-217F. This value is based on XP Power's reliability testing and may vary depending on the specific application and operating conditions.