The recommended land pattern for ICM0805ER371M is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While ICM0805ER371M is rated for operation up to 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. This is because the component's reliability and lifespan may be affected. If high-temperature operation is required, consider using a high-temperature-rated component or consulting with a Vishay Dale application engineer.
To prevent damage, handle ICM0805ER371M by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
The recommended soldering profile for ICM0805ER371M is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of component damage.
While ICM0805ER371M is not hermetically sealed, it is designed to operate in normal ambient environments. However, it's not recommended to use it in humid or moist environments, as this may affect the component's reliability and lifespan. If operation in humid environments is required, consider using a component with a higher moisture sensitivity level (MSL) rating or applying conformal coating.
