A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize signal reflections. A 50-ohm microstrip transmission line should be used for the RF signal path.
Ensure good thermal conductivity by using a thermal pad or thermal tape to attach the device to a heat sink or metal plate. Also, reduce the power consumption by optimizing the biasing and operating conditions.
Use a TVS (Transient Voltage Suppressor) diode or a spark gap ESD protection device at the input and output ports to protect against electrostatic discharge.
Use a voltage regulator to maintain a stable voltage supply. Adjust the bias voltage and current to achieve the optimal operating point, typically around 5V and 10mA. Monitor the device's temperature and adjust the bias accordingly.
Store the devices in their original packaging or in a dry, ESD-protected environment. Handle the devices by the body, avoiding touching the leads or die. Use an anti-static wrist strap or mat when handling the devices.
HSMS-2828-TR1G datasheet
by Avago Technologies
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