The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a thermal plane on the PCB.
To optimize power consumption, use the device's built-in power-saving features such as dynamic voltage and frequency scaling, and adjust the clock frequency and voltage supply according to the system's requirements. Additionally, consider using a low-power mode or shutdown mode when the device is not in use.
The recommended settings for the internal voltage regulators depend on the specific application and operating conditions. As a general guideline, set the voltage regulators to provide a stable 1.2V core voltage and 1.8V I/O voltage, with a maximum current rating of 1A.
To ensure signal integrity and minimize EMI, use a multi-layer PCB with a solid ground plane, and route high-speed signals on the top layer. Use differential signaling and impedance-controlled traces, and add decoupling capacitors near the device to reduce noise and EMI.
Recommended test and validation procedures include functional testing, parametric testing, and environmental testing such as temperature and humidity testing. Additionally, perform signal integrity testing, power consumption testing, and electromagnetic compatibility (EMC) testing to ensure the device's reliability and performance.
HSMP-4820-BLKG datasheet
by Avago Technologies
